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 Posted: Fri 19:58, 14 Jan 2011 Post subject: stivali ugg Electroforming Microstructure of ultra |
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Electroforming Microstructure of ultrafine grained materials research
Are additive, the grain was randomly distributed, that there is no texture; when the electroforming solution without additives, the grain had preferred orientation,[link widoczny dla zalogowanych], that is parallel to the direction of the fibrous texture of grain growth exists. [1] Philip Chan, Wu, Jiang Yongan. Electroforming [M]. Beijing: Ordnance Industry Press, 1992.191. [2] Natter. H,[link widoczny dla zalogowanych], HempelmannR. J. Phys. Chem. , 1996,100:19525. [3] WangN, PaulumboG,[link widoczny dla zalogowanych], WangZ, ErbU, AustKT, ScriptaMetal1. Mater. , 1993,28:253. [4] Qiu Shirong. Copper electroforming process [A]. State machinery and electronics industry,[link widoczny dla zalogowanych], research meeting 1998,9 201. [5] Opalman. LinkOpalOperatorgGuide. OxfordInstrumentMicroanalysisgroup. 1995,61. [6] Tian Wenhuai, Hu Shilian, et al. Electron backscatter diffraction on polycrystalline copper electroforming micro-texture of [J]. Electron Microscopy, 1999,18 (Suppl): 5. [7] PangarovNA, ElectroanalyticalChem. , 1965,9:79. AStudyontheMicrostructureofUltramicronCopperMadebyElectroformingFANAi-ling one, HEHuai. tang. , TIANWen-huai, SUNQi (1.UniversityofScienceandTechnologyBeijing, Beijing100083, China; 2.TaiyuanHeavyMachineryInstitute, Taiyuan030024, China; 3.TaiyuanBoilerCompany, Taiyuan030024, China; 4.201Insititute, Taiyuan030024, China) Abstract: Inthispaper,[link widoczny dla zalogowanych], theuhramicronmetalcopperwaspreparedbyelectro-formingmethodandtherelationbe · tweentechnologicalparametersandmaterialmicrostructureswasresearched. Scanningelectronmicroscopy (SEM) oberservationsweremadeforexaminingthemicrostructuresinvarietyofelectroformedcopperpolystallinematerials. Specially, electronbackscatteringkikuchipattern (EBSP) techniquewasutilizedtoexaminethemicro · textureinthesematerials, SEMobservationshaverevealedthatthiselectroformedcoppermaterialshasagrainsizeofabout1m · 3mandthegrainswerefoundtohaveapreferentialorientationalongthegrowthdirection. EBSPanalyseshavedemonstratedthattheadditionagenthasaneffectonthetexture. Keywords: electroforming; ultramicronmaterials; microstructure; electronbackscatteringpattern
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