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lep591s6a
PostPosted: Wed 3:06, 06 Apr 2011    Post subject: LED industry with the introduction and application

led industry in particular is currently considering how to reduce costs and improve productivity, led sign and also meet the needs of environmental protection and industrial safety, etc., can be expectedto have the operating system standardization and process automation equipment, production lines will be the future mass production of led main competition.
although the mosaic of 400μm & time500μm territory extended electrode area, for reducing the favorable p-type ohmic contact resistance, but increased the distance between the current transport, neon sign may increase the body resistance, the two effects offset the iv characteristics makes the chip smaller size of the mosaicof 350μm & time350μm similar chip layout. 350μm & time350μm diagonal layout with diagonal electrode, the measured iv characteristics show that the p electrode wire electrode and the distance n or less, chip mosaic iv characteristics of the electrode chip considerable.
well-known, led is a semiconductor product, if the led pin of the two pins or more components between the medium voltage exceeds the breakdown strength, it will cause damage to the device. the thinner oxide layer, the led message board ic and the greater the sensitivity of static, such as solder is not full, the quality of the solder itself, problems, etc., will have a serious leak paths, resulting in devastating damage. another failure was due to the node temperature exceeds the melting point of semiconductor silicon (1415 ℃) arising from. pulse energy can generate static electricity localized heating, resulting in the breakdown of the lamp and the ic directly to the fault.

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